LFBGA packaging stress measurements with piezoresistive sensors

Piezoresistive sensor has been demonstrated to be an accurate and efficient tool for stress measurements on chip surfaces inside microelectronic packaging. In this work, square test chips with four piezoresistive stress sensors and the accompanied diode temperature sensors have been first designed, fabricated and calibrated. A heater was also laid at the chip center. We next packaged test chips into 196-ball LFBGA (Low profile, Fine pitch BGA) packaging and measured stresses on chip surfaces inside the packaging. After measuring the packaging-induced stresses as well as stresses under constant environment temperatures, it was found that compressive stresses were obtained at room temperature, and the compressive stresses are relaxed as temperature increases. It was also found in the same experiments that the average slopes of the temperature-stress curves are between 0.45 Mpa//spl deg/C/spl sim/0.65 Mpa//spl deg/C, and localized stress distributions are observed. For thermal stress experiments, temperatures on chip surfaces at different power levels were first derived. Compressive chip stresses were next measured and the stresses then become tension as the chip power increased. Since all of the measured stresses are much less than the yielding stress, it is concluded that chips inside 196-ball LFBGA packaging will not failure due to thermomechanical effects during regular operations.