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Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature
- Source :
- Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2021:000031-000040
- Publication Year :
- 2021
- Publisher :
- IMAPS - International Microelectronics Assembly and Packaging Society, 2021.
Details
- ISSN :
- 23804491
- Volume :
- 2021
- Database :
- OpenAIRE
- Journal :
- Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
- Accession number :
- edsair.doi...........d651ac4111a4416f1a2ca5d6065728e1
- Full Text :
- https://doi.org/10.4071/2380-4491.2021.hitec.000031