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Design of a Broadband HTCC SIP Packaging Module
- Source :
- 2021 International Conference on Microwave and Millimeter Wave Technology (ICMMT).
- Publication Year :
- 2021
- Publisher :
- IEEE, 2021.
Details
- Database :
- OpenAIRE
- Journal :
- 2021 International Conference on Microwave and Millimeter Wave Technology (ICMMT)
- Accession number :
- edsair.doi...........d5f747fcbb2c5b604075a1b528a25233