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A novel on-chip fractal power tree network based on leaf vein grids

Authors :
Qing-Xin Chu
JianKang Xiao
Hui-Fen Huang
Source :
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS).
Publication Year :
2009
Publisher :
IEEE, 2009.

Abstract

In this paper, fractal power network has been proposed. The fractal structure is designed based on leaf vein. The simulated and measured results illustrate that the designed power network has greatly improved noise isolation, resistive and inductive voltage drop, and “Swiss Cheese” effect (There are many vias in the power plane just like many holes in Swiss Cheese. These via areas and their associated anti-pads forms high resistance areas and lead to the voltages or currents to the circuit — elements lower than design demand).

Details

Database :
OpenAIRE
Journal :
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)
Accession number :
edsair.doi...........d52ba97a35e995b2588d8cb3026f1dfe
Full Text :
https://doi.org/10.1109/edaps.2009.5403999