Electronics Packaging Technology Update: BGA, CSP, DCA and Flip Chip

MLA

J.H. Lau. “Electronics Packaging Technology Update: BGA, CSP, DCA and Flip Chip.” Circuit World, vol. 23, Dec. 1997, pp. 22–25. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........d3f54ff24e6b458a6c9748068615b66b&authtype=sso&custid=ns315887.

APA

J.H. Lau. (1997). Electronics Packaging Technology Update: BGA, CSP, DCA and Flip Chip. Circuit World, 23, 22–25.

Chicago

J.H. Lau. 1997. “Electronics Packaging Technology Update: BGA, CSP, DCA and Flip Chip.” Circuit World 23 (December): 22–25. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........d3f54ff24e6b458a6c9748068615b66b&authtype=sso&custid=ns315887.