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3D X-ray Microscope (XRM) Applied to Semiconductor Embedded in Substrate Defect Analysis

Authors :
Cheng-Hsin Liu
Yu-Hsiang Hsiao
Yi-Sheng Lin
Source :
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Publication Year :
2021
Publisher :
IEEE, 2021.

Details

Database :
OpenAIRE
Journal :
2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Accession number :
edsair.doi...........d29a0d4fd67c2a99bfca99f722fef217
Full Text :
https://doi.org/10.1109/impact53160.2021.9697004