A novel, facile, layer-by-layer substrate surface modification for the fabrication of all-inkjet-printed flexible electronic devices on Kapton

MLA

Ching-Ping Wong, et al. “A Novel, Facile, Layer-by-Layer Substrate Surface Modification for the Fabrication of All-Inkjet-Printed Flexible Electronic Devices on Kapton.” Journal of Materials Chemistry C, vol. 4, Jan. 2016, pp. 7052–60. EBSCOhost, https://doi.org/10.1039/c6tc01066k.

APA

Ching-Ping Wong, Chia-Chi Tuan, Ben deGlee, Yunnan Fang, Manos M. Tentzeris, Philip D. Brooke, Kenneth H. Sandhage, Jimmy Hester, & Taoran Le. (2016). A novel, facile, layer-by-layer substrate surface modification for the fabrication of all-inkjet-printed flexible electronic devices on Kapton. Journal of Materials Chemistry C, 4, 7052–7060. https://doi.org/10.1039/c6tc01066k

Chicago

Ching-Ping Wong, Chia-Chi Tuan, Ben deGlee, Yunnan Fang, Manos M. Tentzeris, Philip D. Brooke, Kenneth H. Sandhage, Jimmy Hester, and Taoran Le. 2016. “A Novel, Facile, Layer-by-Layer Substrate Surface Modification for the Fabrication of All-Inkjet-Printed Flexible Electronic Devices on Kapton.” Journal of Materials Chemistry C 4 (January): 7052–60. doi:10.1039/c6tc01066k.