Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test

Three-dimensional (3D) SoC is becoming one of the most promising approaches for extending Moore's Law. However, managing test optimized scheme to reduce the cost of 3D SoCs is a significant challenge. In this paper, we propose a cost-effective optimized scheme of 3D SoCs for pre-bond test based on a generic cost model we defined. Both test time and number of TSV are considered in our novel scheme. Experimental results on ITC'02 SoC benchmark circuits show that our scheme is superior to one baseline solution and can effectively achieve good performance on test optimization.