Low-temperature wafer-scale warm embossing for mix and match with UV lithography

The combination of nanoimprint (hot embossing) and UV-lithography has been demonstrated. For this purpose an UV-sensitive epoxy based resin (mr-L 6000-1 xp) with a low glass temperature (T g ) was prepared by adding low molecular weight components, in particular by increasing the monomer content. The suitability of our approach to minimise process temperatures was tested by embossing and UV-lithography. Mix and match of both techniques was used to demonstrate that the embossing step did not degrade the UV sensitivity of the material. UV processing provided in addition a simple means for stabilisation of this low T, material. Resists like mr-L 6000-1 xp may close the gap between hot embossing, UV-molding and UV-lithography.