High-Frequency Transmission Characteristics of the Interconnects Stacked into the 3D IC Configuration

Authors :: Koji Soejima
Masaya Kawano
Yoichiro Kurita
Shuhei Amakawa
Norikazu Motohashi
S. Matsui
Kazuya Masu
Source :: Journal of Japan Institute of Electronics Packaging. 14:501-506
Publication Year :: 2011
Publisher :: Japan Institute of Electronics Packaging, 2011.

Subjects :: Materials science
Transmission (telecommunications)
business.industry
Optoelectronics
Three-dimensional integrated circuit
Electrical and Electronic Engineering
business

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