Investigation into the effects of magnetic agitation and pulsed current on the development of Sn Cu alloy electrodeposits

Sn Cu alloy electrodeposits have found a wide range of applications in the electronics, automotive and aerospace industries. In the current research, the electrodeposition of Sn Cu alloy coatings produced from an electrolyte based on fluoroboric acids was thoroughly studied. The cathode current density was found to have a significant impact on the appearance and the surface morphology of Sn Cu alloy electrodeposits. Our experimental results suggested that deposition current density, magnetic agitation and pulsed current parameters (pulse frequency and duty cycle) were all found to be crucial factors significantly affecting the chemical composition of the Sn Cu alloy electrodeposits. In addition, the employment of pulsed current techniques significantly improved the edge effect and the surface roughness. Whisker growth on the Sn Cu alloy electrodeposits was assessed. All the samples subjected to different electroplating condition were prone to develop Sn whiskers after a few weeks of storage at room temperature.