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Local-damascene-finFET DRAM integration with p/sup +/ doped poly-silicon gate technology for sub-60nm device generations

Authors :
Wonshik Lee
Seung-Chul Yang
Yang-Keun Park
Byung-Hyuk Roh
Kyu-Hyun Lee
Eun-Cheol Lee
Jin-woo Lee
Yong-Sung Kim
Soo-Ho Shin
Sung-hee Han
Won-suk Yang
Ju-Yong Lee
Dong-il Bae
Bo-Young Song
Jun Han
Joon-Ho Sung
Dong-jun Lee
Kinam Kim
Sang-Hyeon Lee
Tae-Young Chung
Source :
IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..
Publication Year :
2005
Publisher :
IEEE, 2005.

Abstract

We integrate FinFET DRAM in sub-60nm feature size. To avoid severe passing gate effects in FinFET cell array, we introduce a local damascene gate structure. Threshold voltage control of the ultra thin body transistors is successfully achieved by adopting p+ boron in-situ doped poly-silicon gate on the FinFET cells. As a result, very stable and uniform operation of FinFET cells is realized. The local damascene FinFET with p+ gate can become a highly feasible mainstream DRAM technology for sub-60nm low-power high-speed devices

Details

Database :
OpenAIRE
Journal :
IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.
Accession number :
edsair.doi...........cd4b86c68b50b76ffa5b62d0783d8179
Full Text :
https://doi.org/10.1109/iedm.2005.1609338