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Local-damascene-finFET DRAM integration with p/sup +/ doped poly-silicon gate technology for sub-60nm device generations
- Source :
- IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..
- Publication Year :
- 2005
- Publisher :
- IEEE, 2005.
-
Abstract
- We integrate FinFET DRAM in sub-60nm feature size. To avoid severe passing gate effects in FinFET cell array, we introduce a local damascene gate structure. Threshold voltage control of the ultra thin body transistors is successfully achieved by adopting p+ boron in-situ doped poly-silicon gate on the FinFET cells. As a result, very stable and uniform operation of FinFET cells is realized. The local damascene FinFET with p+ gate can become a highly feasible mainstream DRAM technology for sub-60nm low-power high-speed devices
- Subjects :
- Hardware_MEMORYSTRUCTURES
Materials science
Silicon
business.industry
Doping
Transistor
Electrical engineering
Copper interconnect
chemistry.chemical_element
Hardware_PERFORMANCEANDRELIABILITY
Threshold voltage
law.invention
chemistry
law
Low-power electronics
MOSFET
Hardware_INTEGRATEDCIRCUITS
Optoelectronics
business
Dram
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.
- Accession number :
- edsair.doi...........cd4b86c68b50b76ffa5b62d0783d8179
- Full Text :
- https://doi.org/10.1109/iedm.2005.1609338