Thermal Analysis of Multi-Chip-Composed Microsystem

Thermal analysis of an instrumentation microsystem, based on MCM (Multi Chip Module) technology with an active silicon platform, is presented. Results of theoretical analysis (analytical solutions based on thermal-electrical analogy, numerical FEM-simulations) are verified by measurements on a real system. The glue bonding layer (used for die attachment) and the package-to-ambient interface have been identified as the dominant thermal resistors. The measured thermal response time (time constant < 1 s) and good temperature distribution of the MCM microsystem (no hot-spots) indicate that a single-point adaptive thermal management scheme is required and sufficient to increase functional availability of all subsystems, and to maintain reliability and accuracy of the entire microsystem.