Microprocessor Processes and Devices in Post Exascale Computing Era

The physical limit of traditional CMOS process is approaching, and the progress of processes and devices has become the key problem to the development of microprocessor technology in the post exascale computing era. In this paper, the traditional CMOS process, packaging process and new principle devices are prospected, and the current situation and development prospect of various processes and devices are analyzed. Firstly, the development trend of CMOS process in transistor structure, integration and power consumption is analyzed; Secondly, 3D packaging, 2.5D packaging, chiplet, thruchip interface and wafer scale integration technologies are analyzed; Finally, the negative capacitance transistors, tunneling transistors, two-dimensional semiconductor transistors, carbon nanotube transistors and compute-in-memory technologies using phase change memory and resistive memory are analyzed.