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Influence of the process parameters on the replication of microstructured freeform surfaces

Authors :
Christian Kukla
Martin Burgsteiner
Clemens Holzer
Thomas Lucyshyn
Florian Müller
Source :
AIP Conference Proceedings.
Publication Year :
2014
Publisher :
American Institute of Physics, 2014.

Abstract

Surfaces of technical parts are getting more and more attention in terms of functionalization. By modification, additional functionality is given to the part, e.g. self-cleaning effect or antireflection behavior. Nowadays mainly flat surfaces are structured which is a consequence of the available production methods. However, the demand of micro structured free form surfaces is increasing, enabling novel products. A major problem in the mass production (e.g. injection molding) of structured freeform surfaces is to demold these structures without ripping or deforming them due to occurring undercuts. Recently a novel concept was developed which overcomes this limitation. A nickel substrate containing a structure composed of lines orientated in two different directions, one orientated in melt flow direction, the other one perpendicular to that, but both with a cross-section of approximately 45 μm × 55 μm (w × h) was used as a premaster to cast a flexible master. This master made of poly(dimethylsiloxane) (PDMS) was mounted on a bending edge in an injection mold cavity. Within this paper the influence of process parameters on the replication grade of the structure lines depending on the structure orientation was evaluated, varying the holding pressure, melt and mold temperature using statistical design of experiment methods. The replication grade was evaluated by characterizing the shape of the structure lines along the entire process chain, using an infinite focus system. The results show, that the melt temperature has the biggest influence on the dimensions of the structures, the mold temperature only a slight one.

Details

ISSN :
0094243X
Database :
OpenAIRE
Journal :
AIP Conference Proceedings
Accession number :
edsair.doi...........c7da8c0c9d3b8476157452e654b85d73