Electrical properties of Si−SiO2 structures treated in helium plasma

Experimental data are presented for the influence of helium plasma on the electrical properties of Si−SiO 2 structures with dry thermal oxide (d=16−72 nm). It is found that for strongly damaged structures low temperature helium plasma introduces acceptor-type interface states near the conduction band edge and has an annealing effect on the deep acceptor-type states. It has also shown that the initial characteristics of the Si−SiO 2 structures and the gas used are critical for the plasma-forming of both the interface and inversion channel properties.