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Molecular Approach To Enhance Thermal Conductivity in Electrically Conductive Adhesives
- Source :
- ACS Applied Electronic Materials. 1:1890-1898
- Publication Year :
- 2019
- Publisher :
- American Chemical Society (ACS), 2019.
-
Abstract
- Significant heat generation in modern high-speed electronic devices requires elevated thermal conductivity of electrically conductive adhesives (ECAs), but the gap between discrete filler materials...
Details
- ISSN :
- 26376113
- Volume :
- 1
- Database :
- OpenAIRE
- Journal :
- ACS Applied Electronic Materials
- Accession number :
- edsair.doi...........c3cb844453b8c5b826d968321c5a48fe