Silicon-Containing Additives in Encapsulation of Phase Change Materials for Thermal Energy Storage

Microencapsulated phase change materials (MEPCMs) are effective solutions for addressing the issue of leakage that phase change materials (PCMs) face in thermal energy storage devices. Their applications are ubiquitous as PCMs are utilized in industries such as logistics, construction, electronics, etc., thus, an efficient method to prevent problems such as leakage and poor thermal conductivity is to encapsulate the PCM which not only renders it leakage-proof but also impart mechanical strength and enhanced thermal properties. The application of silicon-based additives is one of the most studied methods to impart such desired properties. We discuss the silicon-containing compounds which are commonly employed in core-shell matrix of encapsulated PCMs, namely, siloxanes and silicone, silicon nitride, silicon carbide, silica/SiO2, and other silicon-containing additives as they are able to provide synergistic improvements and exhibit enhanced physical properties. In this review, the different silicon compounds used as additives or main shell matrix are discussed, the general fabrication of the MEPCM and its thermophysical properties will be briefly highlighted. Lastly, we also examine its application and performance in thermal storage and thermal management. We hope to provide a broader perspective of silicon-containing MEPCM for those who are working in the similar field of research.