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A de-embedding technique for interconnects

Authors :
G. Flynn
Feng Ling
W. Blood
E. Demircan
Jiming Song
Source :
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).
Publication Year :
2002
Publisher :
IEEE, 2002.

Abstract

In general, three parameters are needed to model symmetrical adapters, but not enough equations can be found to solve them. The measurement of through adapters gives two conditions only, but neither open nor short adapter gives any useful condition. The results from lines with length L and length 2L can be used to derive the result for through adapters. This paper proposes one approach with a 2-impedance model, which has one shunt impedance and one series impedance. This model can be used with more complicated structures than the single impedance model.

Details

Database :
OpenAIRE
Journal :
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)
Accession number :
edsair.doi...........bcd68e3350bf7a9f4f21349091c4294d
Full Text :
https://doi.org/10.1109/epep.2001.967628