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Substrate current and degradation of n-channel polycrystalline silicon thin-film transistors
- Source :
- Microelectronics Reliability. 45:341-348
- Publication Year :
- 2005
- Publisher :
- Elsevier BV, 2005.
-
Abstract
- Experimental investigation of the substrate current Isub as a function of the gate voltage has been performed in n-channel polycrystalline silicon thin-film transistors (polysilicon TFTs), considering the drain voltage as a parameter of the study. At low gate voltages, Isub exhibits a peak located close to the threshold voltage of the transistor due to hot-carriers generated by impact ionization. At higher gate voltages, Isub increases monotonically with increasing the gate voltage, which is attributed to the temperature rise owing to self-heating. The degradation behavior of polysilicon TFTs, stressed under two different gate and drain bias conditions that cause the same substrate current due to hot-carrier and self-heating effects, is investigated.
- Subjects :
- Materials science
Negative-bias temperature instability
business.industry
Polysilicon depletion effect
Gate dielectric
Electrical engineering
Drain-induced barrier lowering
Time-dependent gate oxide breakdown
Condensed Matter Physics
Atomic and Molecular Physics, and Optics
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials
Threshold voltage
Gate oxide
Optoelectronics
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
business
Metal gate
Subjects
Details
- ISSN :
- 00262714
- Volume :
- 45
- Database :
- OpenAIRE
- Journal :
- Microelectronics Reliability
- Accession number :
- edsair.doi...........bc76f2732890d82852a74397dc610992