Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review

Authors :: Lei Zhang
Mu-lan Li
Xi Wang
Source :: Journal of Materials Science: Materials in Electronics. 33:2259-2292
Publication Year :: 2021
Publisher :: Springer Science and Business Media LLC, 2021.

Subjects :: Materials science
Metallurgy
Electronic packaging
Electrical and Electronic Engineering
Condensed Matter Physics
Microstructure
Lead (electronics)
Atomic and Molecular Physics, and Optics
Electronic, Optical and Magnetic Materials

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