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Materials jetting technology — MPM breakthrough in solder deposition for ultra-fine pitch

Authors :
Richard Booth
Source :
Microelectronics Journal. 28:xiv-xviii
Publication Year :
1997
Publisher :
Elsevier BV, 1997.

Subjects

Subjects :
Materials science
Soldering
General Engineering
Nanotechnology
Ultra fine
Deposition (chemistry)

Details

ISSN :
00262692
Volume :
28
Database :
OpenAIRE
Journal :
Microelectronics Journal
Accession number :
edsair.doi...........b9fa4a77c5630e5ff05da46a25884f21

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