A novel VLSI layout fabric for deep sub-micron applications

Proposes a new VLSI layout methodology which addresses the main problems faced in deep sub-micron (DSM) integrated circuit design. Our layout "fabric" scheme eliminates the conventional notion of power and ground routing on the integrated circuit die. Instead, power and ground are essentially "pre-routed" all over the die. By a clever arrangement of power/ground and signal pins, we almost completely eliminate the capacitive effects between signal wires. Additionally. We get a power and ground distribution network with a very low resistance at any point on the die. Another advantage of our scheme is that the arrangement of conductors ensures that on-chip inductances are uniformly negligible. Finally, characterization of the circuit delays, capacitances and resistances becomes extremely simple in our scheme, and needs to be done only once for a design. We show how the uniform parasitics of our fabric give rise to a reliable and predictable design. We have implemented our scheme using public domain layout software. Preliminary results show that it holds much promise as the layout methodology of choice in DSM integrated circuit design.