Antioxidant High‐Conductivity Copper Pastes Based on Core–Shell Copper Nanoparticles for Flexible Printed Electronics

Authors :: Lijing Wang
Fen Xia
Wangshu Xu
Guanghua Wang
Shuqing Hong
Fangwen Cheng
Binghui Wu
Nanfeng Zheng
Source :: Advanced Functional Materials.
Publication Year :: 2023
Publisher :: Wiley, 2023.

Subjects :: Biomaterials
Electrochemistry
Condensed Matter Physics
Electronic, Optical and Magnetic Materials

Tools