Dielectrics stability for intermediate BEOL in 3D sequential integration

MLA

Claire Fenouillet-Beranger, et al. “Dielectrics Stability for Intermediate BEOL in 3D Sequential Integration.” Microelectronic Engineering, vol. 167, Jan. 2017, pp. 90–94. EBSCOhost, https://doi.org/10.1016/j.mee.2016.11.006.

APA

Claire Fenouillet-Beranger, Maud Vinet, Virginie Beugin, Névine Rochat, Vincent Jousseaume, Perrine Batude, Daniel Benoit, Christophe Licitra, F. Deprat, N. Rambal, G. Imbert, Véronique Caubet-Hilloutou, & Chloé Guerin. (2017). Dielectrics stability for intermediate BEOL in 3D sequential integration. Microelectronic Engineering, 167, 90–94. https://doi.org/10.1016/j.mee.2016.11.006

Chicago

Claire Fenouillet-Beranger, Maud Vinet, Virginie Beugin, Névine Rochat, Vincent Jousseaume, Perrine Batude, Daniel Benoit, et al. 2017. “Dielectrics Stability for Intermediate BEOL in 3D Sequential Integration.” Microelectronic Engineering 167 (January): 90–94. doi:10.1016/j.mee.2016.11.006.