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Machine vision system for alignment in die-to-wafer bonder
- Source :
- Optical System Alignment, Tolerancing, and Verification XIV.
- Publication Year :
- 2022
- Publisher :
- SPIE, 2022.
Details
- Database :
- OpenAIRE
- Journal :
- Optical System Alignment, Tolerancing, and Verification XIV
- Accession number :
- edsair.doi...........b7b4a23c1bfd25e5081360f6fe96fe43
- Full Text :
- https://doi.org/10.1117/12.2633000