Nanoindentation creep behavior and its relation to activation volume and strain rate sensitivity of nanocrystalline Cu

MLA

Sun Weiming, et al. “Nanoindentation Creep Behavior and Its Relation to Activation Volume and Strain Rate Sensitivity of Nanocrystalline Cu.” Materials Science and Engineering: A, vol. 751, Mar. 2019, pp. 35–41. EBSCOhost, https://doi.org/10.1016/j.msea.2019.02.027.

APA

Sun Weiming, Guixun Sun, Tianyi Zhou, Jiangjiang Hu, Yue Jiang, Zhonghao Jiang, & Jianshe Lian. (2019). Nanoindentation creep behavior and its relation to activation volume and strain rate sensitivity of nanocrystalline Cu. Materials Science and Engineering: A, 751, 35–41. https://doi.org/10.1016/j.msea.2019.02.027

Chicago

Sun Weiming, Guixun Sun, Tianyi Zhou, Jiangjiang Hu, Yue Jiang, Zhonghao Jiang, and Jianshe Lian. 2019. “Nanoindentation Creep Behavior and Its Relation to Activation Volume and Strain Rate Sensitivity of Nanocrystalline Cu.” Materials Science and Engineering: A 751 (March): 35–41. doi:10.1016/j.msea.2019.02.027.