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Investigation of Microprocessor Heat Conduction Paths by Utilizing One-Dimensional Thermal Network

Authors :
Masaru Ishizuka
Tomoyuki Hatakeyama
Shinji Nakagawa
Koji Nishi
Source :
Journal of Japan Institute of Electronics Packaging. 18:167-178
Publication Year :
2015
Publisher :
Japan Institute of Electronics Packaging, 2015.

Subjects

Subjects :
Microprocessor
Materials science
business.industry
law
Thermal network
Electrical engineering
Electrical and Electronic Engineering
Thermal conduction
business
law.invention

Details

ISSN :
1884121X and 13439677
Volume :
18
Database :
OpenAIRE
Journal :
Journal of Japan Institute of Electronics Packaging
Accession number :
edsair.doi...........b18f921dea5e0e1fcd15c5efad557085
Full Text :
https://doi.org/10.5104/jiep.18.167
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