2.3D Hybrid Substrate with Ajinomoto Build-Up Film for Heterogeneous Integration

MLA

Gary Chang-Fu Chen, et al. “2.3D Hybrid Substrate with Ajinomoto Build-Up Film for Heterogeneous Integration.” 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), May 2022. EBSCOhost, https://doi.org/10.1109/ectc51906.2022.00013.

APA

Gary Chang-Fu Chen, John H Lau, Channing Cheng-Lin Yang, Jones Yu-Cheng Huang, Andy Yan-Jia Peng, Hsing-Ning Liu, Tzyy-Jang Tseng, & Ming Li. (2022). 2.3D Hybrid Substrate with Ajinomoto Build-Up Film for Heterogeneous Integration. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc51906.2022.00013

Chicago

Gary Chang-Fu Chen, John H Lau, Channing Cheng-Lin Yang, Jones Yu-Cheng Huang, Andy Yan-Jia Peng, Hsing-Ning Liu, Tzyy-Jang Tseng, and Ming Li. 2022. “2.3D Hybrid Substrate with Ajinomoto Build-Up Film for Heterogeneous Integration.” 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), May. doi:10.1109/ectc51906.2022.00013.