D2.4 - Integration of Si-based UV-photodiodes into a 0.35 μm modular CMOS platform

Authors :: S. Thiele
D. Sommer
D. Gäbler
X. Cao
T. B. Chuan
C. Henkel
Source :: Proceedings SENSOR 2015.
Publication Year :: 2015
Publisher :: AMA Service GmbH, Von-Münchhausen-Str. 49, 31515 Wunstorf, Germany, 2015.

Subjects :: Materials science
CMOS
law
business.industry
Optoelectronics
Modular design
business
Photodiode
law.invention

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