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Measuring Seebeck coefficient on thin film thermoelectric materials without metallization treatment

Authors :
Yao-Shing Chen
Ben-Je Lwo
Shih-Jue Lin
Source :
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Publication Year :
2015
Publisher :
IEEE, 2015.

Abstract

This paper developed a new methodology which is a sandwich-like platform to measure Seebeck coefficient for single layer thin-film thermoelectric devices which are flexible and wearable without environmental limitation. With our new apparatus, a stably controlled temperature gradient environment is created on thin-film test samples so that the commonly used and simple probing can be employed for Seebeck coefficient measurements. This paper finally verified the accuracy and availability of the new experimental design through Seebeck coefficient measurements on a typical organic conductive material (PEDOT)

Details

Database :
OpenAIRE
Journal :
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Accession number :
edsair.doi...........af003b2fc9514c407e9f11a45fc9dc82
Full Text :
https://doi.org/10.1109/impact.2015.7365204