Very High Aspect Ratio (AR>10) through Glass Hole (TGH) Filling in Stagnant Condition By Using DC Plating for Advanced Interposer Applications

MLA

Yiu-Hsiang Chang, et al. “Very High Aspect Ratio (AR>10) through Glass Hole (TGH) Filling in Stagnant Condition By Using DC Plating for Advanced Interposer Applications.” ECS Meeting Abstracts, July 2018, p. 1139. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........ad513883dd85b3f91346078edc101ea4&authtype=sso&custid=ns315887.

APA

Yiu-Hsiang Chang, Jie-Chi Chen, Julie Tseng, James Lin, Ya-Huei Chang, Meng-Chi Huang, Hung-Yi Lin, & Lu Zhang. (2018). Very High Aspect Ratio (AR>10) through Glass Hole (TGH) Filling in Stagnant Condition By Using DC Plating for Advanced Interposer Applications. ECS Meeting Abstracts, 1139.

Chicago

Yiu-Hsiang Chang, Jie-Chi Chen, Julie Tseng, James Lin, Ya-Huei Chang, Meng-Chi Huang, Hung-Yi Lin, and Lu Zhang. 2018. “Very High Aspect Ratio (AR>10) through Glass Hole (TGH) Filling in Stagnant Condition By Using DC Plating for Advanced Interposer Applications.” ECS Meeting Abstracts, July, 1139. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........ad513883dd85b3f91346078edc101ea4&authtype=sso&custid=ns315887.