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The Effects of Oxidation Layer, Temperature, and Stress on Tin Whisker Growth: A Short Review
- Source :
- IOP Conference Series: Materials Science and Engineering. 318:012063
- Publication Year :
- 2018
- Publisher :
- IOP Publishing, 2018.
-
Abstract
- In order to reduce the Tin (Sn) whisker growth phenomenon in solder alloys, the researcher all the world has studied the factor of this behaviour. However, this phenomenon still hunted the electronic devices and industries. The whiskers growth were able to cause the electrical short, which would lead to the catastrophic such as plane crush, the failure of heart pacemaker, and the lost satellite connection. This article focuses on the three factors that influence the whiskers growth in solder alloys which is stress, oxidation layer and temperature. This findings were allowed the researchers to develop various method on how to reduce the growth of the Sn whiskers.
- Subjects :
- 010302 applied physics
Materials science
Whiskers
chemistry.chemical_element
02 engineering and technology
021001 nanoscience & nanotechnology
01 natural sciences
Stress (mechanics)
chemistry
Whisker
Soldering
0103 physical sciences
Composite material
0210 nano-technology
Tin
Short circuit
Layer (electronics)
Subjects
Details
- ISSN :
- 1757899X and 17578981
- Volume :
- 318
- Database :
- OpenAIRE
- Journal :
- IOP Conference Series: Materials Science and Engineering
- Accession number :
- edsair.doi...........ac7aacb31b5e1ee745c25124a8dc3fab