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A 120 GHz wideband low-power down converter for wireless chip-to-chip communication
- Source :
- 2018 IEEE 18th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF).
- Publication Year :
- 2018
- Publisher :
- IEEE, 2018.
-
Abstract
- This paper presents a 120 GHz low-power down converter in a 65 nm complementary metal-oxide-semiconductor (CMOS) process for chip to chip communication. The center frequency of the down converter is 120 GHz. The proposed down converter consists of an active balun, a down conversion mixer, and a baseband amplifier. The average insertion loss of the active balun was − 1 dB within a 3 dB bandwidth. The down conversion mixer achieved a conversion gain of − 13 dB with a local oscillator (LO) power of as small as − 10 dBm. The peak gain of the baseband amplifier was 28.3 dB with a 3 dB bandwidth of 7.7 GHz. This down converter achieves a high conversion gain of 14.3 dB with an LO power of − 10.6 dBm. The proposed down converter consumes 25 mW and has a chip size of 0.89 mm2.
- Subjects :
- Materials science
Digital down converter
business.industry
Amplifier
Local oscillator
Bandwidth (signal processing)
020206 networking & telecommunications
02 engineering and technology
Balun
0202 electrical engineering, electronic engineering, information engineering
Baseband
Optoelectronics
Insertion loss
Wideband
business
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2018 IEEE 18th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)
- Accession number :
- edsair.doi...........abc0cdb598b80d6aa7981a7a2d34475e
- Full Text :
- https://doi.org/10.1109/sirf.2018.8304222