Multiscale simulations for exploring photo-chemical processes to mitigate the critical dimension variability of contact holes in EUV lithography

MLA

Muyoung Kim, et al. “Multiscale Simulations for Exploring Photo-Chemical Processes to Mitigate the Critical Dimension Variability of Contact Holes in EUV Lithography.” Journal of Materials Chemistry C, vol. 9, Jan. 2021, pp. 8189–203. EBSCOhost, https://doi.org/10.1039/d1tc00891a.

APA

Muyoung Kim, Byunghoon Lee, Taegyeom Kim, Maenghyo Cho, Hyungwoo Lee, & Sung Woo Park. (2021). Multiscale simulations for exploring photo-chemical processes to mitigate the critical dimension variability of contact holes in EUV lithography. Journal of Materials Chemistry C, 9, 8189–8203. https://doi.org/10.1039/d1tc00891a

Chicago

Muyoung Kim, Byunghoon Lee, Taegyeom Kim, Maenghyo Cho, Hyungwoo Lee, and Sung Woo Park. 2021. “Multiscale Simulations for Exploring Photo-Chemical Processes to Mitigate the Critical Dimension Variability of Contact Holes in EUV Lithography.” Journal of Materials Chemistry C 9 (January): 8189–8203. doi:10.1039/d1tc00891a.