The laser shaping of ceramic by a fracture machining technique

A new laser machining technique for ceramic shaping, based on the concept of fracture mechanics, is proposed in this paper. The principle of fracture machining technique is investigated. A focused laser is used to scribe two groove-cracks at the two intersecting surfaces of the rectangular substrate. Then, a defocused laser beam is applied throughout the length of the groove-cracks to generate a great thermal stress, which makes the two groove-cracks link together. The material removal is due to the linkage of the groove-cracks. Conventional laser machining requires high laser power to evaporate the materials. The high temperature gradient would induce the formation of micro-cracks, which leads to a remarkable reduction in strength. The laser power required in the method proposed is only a tenth of what is required in the conventional method under the same material removal rate, and in addition, the amount of the micro-crack is smaller. The experimental specimens are alumina ceramics, and the laser sources are a CO2 laser and a Nd:YAG laser. The fracture machining technique can be successfully employed for step shaping and blind corner shaping for a thick ceramic substrate. The relationships of machining parameters such as groove-crack depth, material removal rate, laser scanning speed, and laser power are discussed. Finally, the measurement of the surface roughness and the inspection of crack defects are examined thoroughly.