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3D sequential integration: applications and associated key enabling modules (design & technology)
- Source :
- 2021 IEEE International Electron Devices Meeting (IEDM).
- Publication Year :
- 2021
- Publisher :
- IEEE, 2021.
Details
- Database :
- OpenAIRE
- Journal :
- 2021 IEEE International Electron Devices Meeting (IEDM)
- Accession number :
- edsair.doi...........a954addef7e27e3dfae349b36fd38937
- Full Text :
- https://doi.org/10.1109/iedm19574.2021.9720671