SEIFF: Soft Error Immune Flip-Flop for Mitigating Single Event Upset and Single Event Transient in 10 nm FinFET

This paper proposes soft error immune flip-flop (SEIFF) for mitigating single event upset (SEU) in flip-flops (FFs) and impact of single event transient (SET) in combinational-logic. SEIFF mitigates the SET without enlarging setup-time and delay; there is no overhead in circuit performance. Alpha and proton tests validate the mitigation efficiency in SEIFF manufactured on 10 nm FinFET technology.