High temperature application of diamond power device

Diamond is a promising material for future high power devices due to high breakdown field, low dielectric constant and high carrier mobility, respectively. From one-dimensional device model, 90% reduction of the power loss is expected by using diamond Schottky barrier diode instead of SiC diode for high temperature power device applications. The high breakdown field of more than 3 MV/cm has been realized by utilizing high Schottky barrier height. The diodes show low leakage current and low on-resistance even at high temperature conditions.