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Effects of Rheological Properties on the Thermal Resistance of Gel Thermal Interface Materials

Authors :
Chenxu Zhang
Linlin Ren
Xiaoliang Zeng
Rong Sun
Source :
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publication Year :
2022
Publisher :
IEEE, 2022.

Details

Database :
OpenAIRE
Journal :
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
Accession number :
edsair.doi...........a467f94eca9d77bdf9a34d9e7353242c