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Intergranular Interactions and Thermal Stability in Fe–Ti–N Thin Films
- Source :
- IEEE Transactions on Magnetics. 43:3661-3667
- Publication Year :
- 2007
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 2007.
-
Abstract
- Intergranular interactions and thermal stability factors in Fe-Ti-N thin films were studied as a function of nitrogen content. This was done through: 1) measurements of the isothermal remanence magnetization and direct current demagnetization, coupled with an analysis based on a modified Che-Bertram interaction field model for the intergranular interactions and 2) measurements of the dependence of the coercive force on the holding time for the applied field, coupled with a Sharrock analysis in the case of the thermal stability. The data indicate that the intergranular interactions are mainly exchange dominated for nitrogen levels in the 0-4 at.% range, become primarily magnetostatic for 4-7 at.% nitrogen, and switch back to exchange dominated for higher levels. For nitrogen amounts in the 7-11 at.% range, the thermal stability factors are largest at about 7 at.% and decrease for higher nitrogen amounts. The inferred unit switching lateral size from the Sharrock analysis is about 10-20 times larger than the grain size. The changes in the intergranular interactions and the thermal stability factors with nitrogen content can be qualitatively explained by a grain size effect.
- Subjects :
- Materials science
Demagnetizing field
Thermodynamics
chemistry.chemical_element
Coercivity
Intergranular corrosion
Nitrogen
Grain size
Isothermal process
Electronic, Optical and Magnetic Materials
Nuclear magnetic resonance
chemistry
Remanence
Thermal stability
Electrical and Electronic Engineering
Subjects
Details
- ISSN :
- 00189464
- Volume :
- 43
- Database :
- OpenAIRE
- Journal :
- IEEE Transactions on Magnetics
- Accession number :
- edsair.doi...........a402b3b80cfd387e92d3b6433bd994a0