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Laser shock micro clinching of Al/Cu
- Source :
- Journal of Materials Processing Technology. 258:200-210
- Publication Year :
- 2018
- Publisher :
- Elsevier BV, 2018.
-
Abstract
- The influences of ablative layer, soft punch, die depth, and laser energy on novel micro clinching of Al/Cu were investigated. Ablative layer thickness notably influenced metal flow including neck and interlock; the relationship between reasonable ablative layer thickness and certain laser energy range was summarized. Soft punch with 100 μm was more suitable than with other thickness for the process. In the joinable laser energy range, with increase of laser energy, interlock thickness gradually increased, whereas the neck and bottom thicknesses gradually decreased. The process window of Al/Cu combination was acquired, and a certain thickness difference which was at least 40 μm inevitably existed between the upper and lower metal foils. For every joinable combination, matching function of optimum die depth are derived based on Al and Cu foil thickness when the thickness of each metal foil was less than 200 μm. The single lap shearing test showed that the tensile strength and failure model of the joint both depended on neck and interlock thicknesses; only the joint that simultaneously formed a large interlock and large neck can attain a high joining strength.
- Subjects :
- 0209 industrial biotechnology
Materials science
business.product_category
Metals and Alloys
02 engineering and technology
021001 nanoscience & nanotechnology
Laser
Industrial and Manufacturing Engineering
Computer Science Applications
law.invention
Shock (mechanics)
020901 industrial engineering & automation
law
Modeling and Simulation
Ultimate tensile strength
Ceramics and Composites
Die (manufacturing)
Composite material
0210 nano-technology
Interlock
business
Shearing (manufacturing)
Layer (electronics)
FOIL method
Subjects
Details
- ISSN :
- 09240136
- Volume :
- 258
- Database :
- OpenAIRE
- Journal :
- Journal of Materials Processing Technology
- Accession number :
- edsair.doi...........a2fe6fd6910580bd371cd5baa51c2869
- Full Text :
- https://doi.org/10.1016/j.jmatprotec.2018.04.005