Cite

Creep properties of Sn-rich solder joints

MLA

J. W. Morris, et al. “Creep Properties of Sn-Rich Solder Joints.” 53rd Electronic Components and Technology Conference, 2003. Proceedings, June 2004. EBSCOhost, https://doi.org/10.1109/ectc.2003.1216256.



APA

J. W. Morris, H.G. Song, & F. Hua. (2004). Creep properties of Sn-rich solder joints. 53rd Electronic Components and Technology Conference, 2003. Proceedings. https://doi.org/10.1109/ectc.2003.1216256



Chicago

J. W. Morris, H.G. Song, and F. Hua. 2004. “Creep Properties of Sn-Rich Solder Joints.” 53rd Electronic Components and Technology Conference, 2003. Proceedings, June. doi:10.1109/ectc.2003.1216256.