Integration of Micro-cooling Pipe in LTCC Board for RF Communication

In this paper, a fabrication method of integrating micro-cooling pipe in LTCC board was proposed. In the experimental procedures, the micro-cooling pipe channels were filled by strip sacrificial materials. The experimental results showed that filling sacrificial materials could effectively prevent the channels from deformation or collapse during lamination and sintering process. Through the heat dissipation test, there were obvious temperature decreases, when the deionized water was pumped into the micro-cooling pipe. In the electrical performance test, the RF insertion loss of a single vertical interconnection was around 1dB and the insertion loss from total input branch to output branch was around 17dB. The test results prove that this fabrication method of integrating micro-cooling pipe into LTCC board is effective in practical use and can be applied to millimeter wave circuit for RF communication.