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Robust bonding at 175°C of pressureless Ag nanoparticle sinter joint on Ni/Au finished Cu substrates in air
- Source :
- 2023 International Conference on Electronics Packaging (ICEP).
- Publication Year :
- 2023
- Publisher :
- IEEE, 2023.
Details
- Database :
- OpenAIRE
- Journal :
- 2023 International Conference on Electronics Packaging (ICEP)
- Accession number :
- edsair.doi...........9f2344fdb1e4547ad1855439ad62c9fc
- Full Text :
- https://doi.org/10.23919/icep58572.2023.10129758