Stress and thermal modeling of microbolometer using COMSOL multiphysics simulator

MLA

Yu-Zhen Deng, et al. “Stress and Thermal Modeling of Microbolometer Using COMSOL Multiphysics Simulator.” 2018 IEEE International Conference on Applied System Invention (ICASI), Apr. 2018. EBSCOhost, https://doi.org/10.1109/icasi.2018.8394487.

APA

Yu-Zhen Deng, Der-Kuo Tung, & Shiang-Feng Tang. (2018). Stress and thermal modeling of microbolometer using COMSOL multiphysics simulator. 2018 IEEE International Conference on Applied System Invention (ICASI). https://doi.org/10.1109/icasi.2018.8394487

Chicago

Yu-Zhen Deng, Der-Kuo Tung, and Shiang-Feng Tang. 2018. “Stress and Thermal Modeling of Microbolometer Using COMSOL Multiphysics Simulator.” 2018 IEEE International Conference on Applied System Invention (ICASI), April. doi:10.1109/icasi.2018.8394487.