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Ultra-thin mold cap for Advanced Packaging Technology
- Source :
- 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
- Publication Year :
- 2022
- Publisher :
- IEEE, 2022.
Details
- Database :
- OpenAIRE
- Journal :
- 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
- Accession number :
- edsair.doi...........9e542ecfedddd9d084fc958e8a4f7927