Sample Preparation Techniques for Analysis and Debug of Circuits with Cu Inductors and Thick Organic Dielectric

This paper describes techniques to prepare integrated circuit (IC) samples, containing a Thick Organic Dielectric (TOD) over Cu inductors, for Scanning Electron Microscopy (SEM) or Focused Ion Beam (FIB) editing. Our technique utilizes mechanical polishing and UV laser ablation in lieu of chemical decapsulation and deprocessing.