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Electrodeposition of Sn-Cu Alloys and Its Connecting Reliability for Automotive Connectors

Authors :
Hiroaki Nakano
Satoshi Oue
Daisuke Yoshihara
Hisaaki Fukushima
Yoshifumi Saka
Shigeru Sawada
Yasuhiro Hattori
Source :
Journal of the Japan Institute of Metals. 75:61-68
Publication Year :
2011
Publisher :
Japan Institute of Metals, 2011.

Subjects

Subjects :
Mechanics of Materials
Materials Chemistry
Metals and Alloys
Condensed Matter Physics

Details

ISSN :
18806880 and 00214876
Volume :
75
Database :
OpenAIRE
Journal :
Journal of the Japan Institute of Metals
Accession number :
edsair.doi...........9955ae6dc8419000f1e2832c44b529d0
Full Text :
https://doi.org/10.2320/jinstmet.75.61
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