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Technology, CAD tools, and designs for emerging 3D integration technology
- Source :
- ACM Great Lakes Symposium on VLSI
- Publication Year :
- 2008
- Publisher :
- ACM, 2008.
-
Abstract
- Because of continued advancements in process technology, three-dimensional (3D) integration with stacked chips is emerging as a promising solution to meet the challenges of high-performance, differentiated technology integration, and smaller form factor in complex System-on-a-Chip (SoC) design. High density vertical connections between stacked strata reduce well-known interconnect delay issues and increases interconnect bandwidth in a 3D chip. Adding the third dimension to design opens up new opportunities for EDA tools and design/architectural techniques to fully explore new approaches and address the challenges of 3D integration.This tutorial will discuss following key topics in 3D integration: -Overview of 3D integration process: Through-Si via, die-on-wafer, wafer-on-wafer bonding -Market applications and drivers for 3D integration -Design techniques for cost-effective 3D integration: 3D IP reuse, design-for-test -Thermal issues in 3D -CAD tools and algorithms for 3D IC design -3D microprocessor design -3D multi-core architectures with network-on-chip
- Subjects :
- Engineering
Process (engineering)
business.industry
Three-dimensional integrated circuit
Hardware_PERFORMANCEANDRELIABILITY
Work in process
Reuse
Form factor (design)
Computer architecture
Embedded system
Hardware_INTEGRATEDCIRCUITS
Technology integration
Electronic design automation
business
Technology CAD
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- Proceedings of the 18th ACM Great Lakes symposium on VLSI
- Accession number :
- edsair.doi...........97c597d5df86de8a456da21ec308c75f